Req. ID: 143069
_Title :_ Study and development of clean bevel in 3D nand Non-Volatile
_Description :_ Due to complexity of memory structure- there are a lot of
new processes and tools being introduced resulted new type of defects which
affecting wafer quality. In this project- student will have exposure on most
advance semiconductor machines- gain experience on the state-of-the-art fab
operation and attain process development/troubleshooting knowledge as require
working with process engineering team on improvement work.
Perform data collection on WiseCam- G6/G7 API- KMAC Bevel Image and KMAC Backsid
Collaboration with process engineers for process improvemen
Students will be able to learn how to use statistical tools- fab specific applications and software for process- perform design of experiment to optimize process
Line comb movie of 1XX layers technode
Develop Best Known Method to have clean bevel and clean backside
All qualified applicants will receive consideration for employment without
regard to race- color- religion- sex- sexual orientation- gender identity-
national origin- veteran or disability status.